The SIPLACE TX placement modules are the new standard in high-volume production. No other placement solution features this level of precision (22 µm at 3 sigma) and speed (up to 78,000 cph) in such a tiny footprint (only 1 m x 2.3 m). For the first time you can place the new generation of smallest components (0201 metric) at full speed like any others.
What would you give to be able to scale your SMT lines according to demand?
SIPLACE SX is the first pick and place solution that is fully scalable with demand thanks to its unique interchangeable gantries. A great way to add capacity when needed or reduce capacity when things slow down. We call it SIPLACE Capacity-on-Demand.
Among electronics manufacturers, the SIPLACE X-Series is considered the benchmark wherever maximum speed and absolute precision are required (mobile phones, tablets, notebooks, LED placement, etc).
Put its top-of-the-line speed, lowest dpm rates, consistent 0201 (metric) capability, non-stop setup changeovers and fast new product introductions to use for you.
The SIPLACE X-Series is available with two, three or four gantries with gantry modularity.
No compromises in terms of speed and accuracy
Up to 28,000 dies, 42,000 flip-chips or 80,000 SMT components per hour – specifications that speak for themselves. A special vision system enables the SIPLACE CA to place bare dies in sizes ranging from 0.5 to 27.0 mm with an accuracy of ±10 µm @ 3 σ with eWLB option. For SMT placement, the SIPLACE CA is fully 0201 (metric)-capable.